IPC标准一览表

IPC Document Revision TableIPC标准、文件一览表

Updated May 24, 2000

IPC DOC #

TITLE

Page 1 of 18PUBLICATION/

REVISION DATES

(IPC文件号)

Roadmap

(指南)

SMC-TR-001

名称National Technology Roadmap for Electronic

Interconnections

(美国国家电子互联技术指南)

出版/修订日期

6/95 (orig. pub.)

SMT An Introduction to Tape Automated Bonding & Fine

1/89 (orig. pub.)

Pitch Technology(TAB和细间距SMT介绍)

4/92 (orig. pub.)

Revision: A 1/95

Amendment 1: 3/96

Revision B: 10/96

Revision C: 3/00

J-STD-001Requirements for Soldered Electrical and Electronic

Assemblies

代替 IPC-(电气、电子组件焊接技术要求)

S-815

Handbook and Guide to the Requirements for Soldered

Electrical and Electronic Assemblies to Supplement J-STD-001B

(J-STD-001B学习辅导书)

J-STD-002Solderability Tests for Component Leads,Terminations,

Lugs, Terminals and Wires (元件引线,焊端,接线端和导线的可焊性代替 IPC-S-805

测试)

J-STD-003Solderability Tests for Printed Boards(印制板可焊性测试)

IPC-HDBK-001

3/98 (orig. pub.)

4/92 (orig. pub.)

A 10/98

代替 IPC-S-804

J-STD-0044/92 (orig. pub.)

Revision A: In process

1/95 (orig. pub.)

Amendment 1 - 4/96

Revision A: In process

代替IPC-SF-818

J-STD-005Requirements for Soldering Fluxes(助焊剂技术要求)

代替 IPC-SF-819

Requirements for Soldering Pastes(焊膏技术要求)

1/95 (orig. pub.)

Amendment 1 - 1/95

J-STD-006Requirements for Electronic Grade Solder Alloys and

Fluxed and Non-Fluxed Solid Solders for Electronic

Soldering Applications

1/95 (orig. pub.)

Amendment 1 - 6/96

Revision A: In process

2011-3-4

IPC Document Revision Table(电子级固态焊料技术要求)

Implementation of Flip Chip and Chip Scale Technology

J-STD-012(FC和CSP器件的安装)

J-STD-013IPC-DRM-18

Implementation of Ball Grid Array and Other High

Density Technology(BGA和HDI器件的安装)

Component Identification Desk Reference Manual

(元器件封装辨认手册)

Page 2 of 181/96 (orig. pub.)

7/96 (orig. pub.)

9/95 (orig. pub.)

Revision A: 4/96

Revision B: 2/97

Revision C: 7/98

October 1996 (orig.

pub.)

Revision A: 3/99

Moisture/Reflow Sensitivity Classification of Plastic

J-STD-020Surface Mount Devices(塑封表面器件对潮湿和再流焊的敏感度要求)

Through-Hole Solder Joint Evaluation Desk Reference

IPC-DRM-Manual

40

(通孔引线焊点评估参考手册)

Surface Mount Solder Joint Evaluation Desk Reference

IPC-DRM-Manual

SMT

(表面组装焊点评估参考手册)

8/98

8/75 (orig. pub.)

A - 8/76

B - 6/80

C - 3/85

D - 11/88

E - 7/92

F - 6/96

4/87 (orig. pub.)

Revision A: In process

7/95 (orig. pub.)

IPC-T-50

Terms and Definitions Interconnecting and Packaging

Electronic Circuits(电子电路互连及封装术语和定义)

IPC-SC-60

IPC-SA-61

Post Solder Solvent Cleaning Handbook (焊后溶剂清洗手册)

Post-Solder Semi-Aqueous Cleaning Handbook

(焊后半水清洗手册)

IPC-AC-62

IPC-CH-65

Post Solder Aqueous Cleaning Handbook (焊后水清洗手册)

Guidelines for Cleaning of Printed Boards and Assemblies

(印制板及其组件清洗导则)

12/86 (orig. pub.)

12/90 (orig. pub.)

Revision A: In process

IPC-CS-70

IPC-CM-78

Guidelines for Chemical Handling Safety in Printed Board

8/88 (orig. pub.)

Manufacturing(印制板制造化学处理安全准则)

2011-3-4

IPC Document Revision TablePage 3 of 18被 IPC-SM-780替代

IPC-MP-83

IPC-PC-90

Guidelines for Surface Mounting and Interconnecting

Chip Carriers

IPC Policy on Metrication(IPC公制化导则)

General Requirements for Implementation of Statistical

Process Control(实施SPC的总技术规范)

11/83 (orig. pub.)

C - 3/88

8/85 (orig. pub.)

10/90 (orig. pub.)

4/93 (orig. pub.)

3/76 (orig. pub.)

A 10/80

B 6/90

3/76 (orig. pub.)

A 10/80

B 7/92

A

1/94 (orig. pub.)

Revision A: 12/97

General Requirements for Implementation of ISO 9000

IPC-QS-95

Quality Systems(实施 ISO 9000质量体系的总技术规范)

IPC-L-108

被 IPC-4101替代

IPC-L-109

Specification for Thin Metal Clad Base Materials for

Multilayer Printed Boards

被 IPC-4101 替代

Specification for Resin Impregnated Fabric (Pregreg) for

Multilayer Printed Boards

IPC-L-110 Preimpregnated, B-Stage Epoxy-Glass Cloth for

(已作废) Multilayer Printed Cicuit Boards

IPC-CC-110

被 IPC-4121替代Guidelines for Selecting Core Constructions for

Multilayer Printed Wiring Board Applications

IPC-L-112

Specification for Composite Metal Clad Base materials for 7/81 (orig. pub.)

被 IPC-Printed Boards A 6/92

4101 替代

IPC-L-115

Specification for Rigid Metal Clad Base Materials for

被 IPC-Printed Boards

4101 替代

IPC-L-120 Inspection Procedure for Chemical Processing Suitability

(己作废) of Copper-Clad Epoxy-Glass Laminates

IPC-L-125

IPC-L-130

(已作废)

Specifications for Plastic Substrates Clad or Unclad for

High Speed/High Frequency Interconnections

(高速/高频塑性基板特性规范)

Specificaitons for Thin Laminates, Metal Clad, Primarily

for General-Purpose Multilayer Printed Boards

8/83 (orig. pub.)

A 7/92

3/77 (orig. pub.)

A 10/80

B 4/90

1/77 (orig. pub.)

被 IPC-L-108 替代

2011-3-4

IPC Document Revision TableIPC-EG-140

IPC-SG-141

IPC-A-142

IPC-QF-143

IPC-CF-148

Specification for Finished Fabric Woven from "E" Glass

for Printed Boards("E"纤维织物印制板特性规范)

Specification for Finished Fabric Woven from "S" Glass

for Printed Boards ("S"纤维织物印制板特性规范)

Page 4 of 183/88 (orig. pub.)

A 6/97*

2/92 (orig. pub.)

Specification for Finished Fabric Woven from Aramid for

6/90 (orig. pub.)

Printed Boards(Aramid纤维织物印制板特性规范)

General Specification for Finished Fabric Woven from

Quartz (Pure Fused Silica) for Printed Boards

(石英纤维织物印制板特性规范)

Resin Coated Metal for Printed Boards (印制板涂树脂金属箔)

6/90 (orig. pub.)

A 9/98

8/66 (.)

A 9/67

B 2/71

C 8/74

D 3/76

E 5/81

F 10/91 , 8/92

G 5/99

6/90 (orig. pub.)

A 1/94

B 3/98

7/85 (orig. pub.)

2/92 (orig. pub.)

IPC-MF-150

Metal Foil for Printed Wiring Applications

(印制线路金属箔)

IPC-CF-152

IPC-FC-203

(已作废)

IPC-FC-210

(已作废)

IPC-FC-213

(已作废)

IPC-FC-217

(已作废)

IPC-FC-218B/

EIA-RS-429

(已作废)

IPC-FC-219

Composite Metallic Material Specification for Printed

Wiring Boards (印制板复合金属材料特性规范)

Specification for Flat Cable, Round Conductor, Ground

Plane

Performance Specification for Flat-Conductor

Undercarpet Power Cable (Type FCC)

9/85 (orig. pub.)

Performance Specification for Flat Undercarpet Telephone

9/84 (orig. pub.)

Cable

General Document for Connectors, Electric, Header,

Receptacle,Insulation Displacement for Use with Round

Conductor Flat Cable

General Specification for Connectors, Electrical Flat

Cable Type

8/82 (orig. pub.)

Reaffirmed 4/90

7/76 (orig. pub.)

Reaffirmed 11/81

Reaffirmed 05/91

Environment Sealed Flat Cable Connectors for use in

2011-3-4

IPC Document Revision Table(已作废)

IPC-FC-220

(已作废)

IPC-FC-221

(已作废)

IPC-FC-222

(已作废)

IPC-FC-225

(已作废)

IPC-FC-231

IPC-FC-232

Specification for Flat-Copper Conductors for Flat Cables

Aerospace Applications

Page 5 of 185/84 (orig. pub.)

orig. pub 5/70

A 1/74

B 8/75

C 7/85

8/75 (orig. pub.)

A 5/84

6/80 (orig. pub.)

5/91 Reaffirmed

8/75 (orig. pub.)

10/85 Reaffirmed

orig. pub. 7/74

A 5/83

B 2/86

C 4/92

Amendment 10/95

Specification for Flat Cable, Flat Conductor, Unshielded

Specification of Flat Cable Round Conductor, Unshielded

Flat Cable Design Guide

Flexible Base Dielectrics for Use in Flexible Printed

Wiring

(柔性印制线路的绝缘基材)

代替IPC-FC-233A

IPC-FC-233

(作废)

IPC-FC-241

IPC-RF-245

被 IPC-6013

替代

Adhesive Coated Dielectric Films for Use as Cover Sheets

7/74 (orig. pub.)

A 5/83

for Flexible Printed Wiring and Flexible Bonding Films

B 2/86

C 4/92

(柔性电路绝缘涂覆胶粘剂)

Amendment 10/95

-

Incorporated into IPC-FC-232B

7/74 (orig. pub.)

A 5/83

B 2/86

C 4/92

Amendment 10/95

Flexible Metal-Clad Dielectrics for Use in Fabrication of

Flexible Printed Wiring(柔性印制电路镶嵌金属夹层的绝缘基材)

Performance Specification for Rigid-Flex Printed Boards 4/87 (orig. pub.)

IPC-D-249

被 IPC-Design Standard for Flexible Single-and Double-Sided

2223

Printed Boards

1/87 (orig. pub.)

替代

2011-3-4

IPC Document Revision TableIPC-FC-250A

被 IPC-6013

Page 6 of 18Specification for Single - and Double-Sided Flexible

Printed Wiring

9/86 (orig. pub.)

A 9/86

替代

IPC-FA-251

Guidelines for Single and Double Sided Flex Circuits

2/92 (orig. pub.)

(单、双面柔性电路指南)

IPC-D-275

被 IPC-2221 and

Design Standard for Rigid Printed Boards and Rigid

2222

Printed Board Assemblies

9/91 (orig. pub.)

Amend.1 4/96

替代

IPC-RB-276

被 IPC-Qualification and Performance Specification for Rigid

6011 和Printed Boards

IPC-6012

替代

Design Guidelines for Reliable Surface Mount

Technology Printed Board Assemblies

(可靠的印制板SMT设计指南)

8/60 (orig. pub.)

A 7/61

B 1/64

C 10/65

D 1/70

E 10/70

F 11/74 Editorial

revision

G 1/84

9/69 (orig. pub.)

A 12/77

B 12/85

C 06/91

3/92 (orig. pub.)

IPC-D-279 7/96 (orig. pub.)

Printed Board Dimensions and Tolerances

IPC-D-300

(印制板的尺寸和容差)

IPC-D-310

Guidelines for Phototool Generation and Measurement

Techniques (照相底板生成和测量技术指南)

Process Control Guidelines for Phototool Generation and

IPC-A-311

Use

(照相底板生成和使用过程的控制指南)

3/96 (orig. pub.)

2011-3-4

IPC Document Revision TablePage 7 of 18IPC-D-316

Design Guide for Microwave Circuit Boards Utilizing Soft

5/95 (orig. pub.)

Substrates (软质基材的微波电路设计指南)

4/90 (orig. pub)

A 1/95

Design Guidelines for Electronic Packaging Utilizing

IPC-D-317 High-Speed Techniques(电子封装用于高速技术的设计指南)

IPC-HF-318

被 IPC-6018

Microwave End Product Board Inspection and Test

6/85 (orig. pub.)

A 12/91

替代

IPC-D-319 Design Standard for Rigid Single-and Double-Sided

(作废) Printed Boards

IPC-D-320A

(作废)

1/87 (orig. pub.)

superseded by IPC-D-275

Printed Board, Rigid, Single- and Double-Side, End

Product Standard

1/77 (orig. pub.)

A 3/81

(incorporates/supersedes

IPC-TC-500

superseded by IPC-RB-276

1/77 (orig. pub.)

A 3/81

B 11/86

8/84 orig. pub.

Reaffirmed 9/91

10/88 (orig. pub.)

IPC-SD-320B

(作废)

Performance Specification for Rigid Single- and Double-Sided Printed Boards

Guidelines for Selecting Printed Wiring Board Sizes

IPC-D-322 Using Standard Panel Sizes(拼板中印制板迭用尺寸指南)

IPC-MC-324

Performance Specifications for Metal Core Boards

(金属芯电路板性能规范)

Documentation Requirements for Printed Boards,

1/87 (orig. pub.)

IPC-D-325 Assemblies and Support Drawings (印制板、组件和支撑A 5/95

件图纸文件要求)

IPC-D-326

Information Requirements for Manufacturing Printed

Board Assemblies(印制板组装制造的文件资料要求)

4/91 (orig. pub.)

IPC-D-330 Design Guide Manual(设计指导手册)

IPC-PD-335

(作废)

Electronic Packaging Handbook 12/89 (orig. pub.)

2011-3-4

IPC Document Revision TableComputer Numerical Control Formatting for Drillers and

Routers

(钻孔和布线器的计算机控制数据格式)

Page 8 of 18IPC-NC-349

8/85 (orig. pub.)

8/72 (orig. pub.)

A 2/75

B 8/77

C 10/85 Reaffirmed

D

7/92 Technical Content

Identical to IEC-1182-1

8/85 (orig. pub.)

Printed Board Description in Digital Form

IPC-D-350

(印制板的数字化表述)

Printed Board Drawings in Digital Form

IPC-D-351

(印制板图形的数字化表述)

IPC-D-352

Electronic Design Data Description for Printed Boards in

Digital Form (印制板电子设计数椐的数字化表述)

Library Format Description for Printed Boards in Digital

Form

(印制板文件格式的数字化表述)

Printed Board Assembly Description in Digital Form

IPC-D-355

(印制板组件的数字化表述)

Bare Board Electrical Test Information in Digital Form

IPC-D-356

(印制裸板电测信息的数字化表述)

IPC-AM-361

(作废)

IPC-MB-380

Specification for Rigid Substrates for Additive Process

Printed Boards

Guidelines for Molded Interconnection Devices

10/90 (orig. pub.)

(模制器件互连指南)

7/74 (orig. pub.)

A 2/88

1/90 (orig. pub.)

3/92 (orig. pub.)

A 1/98

1/82 (orig. pub.)

1/95 (orig. pub.)

8/85 (orig. pub.)

IPC-D-354 2/87 (orig. pub.)

IPC-D-390 Automated Design Guidelines(自动设计指南)

IPC-C-406

IPC-CI-408

Design and Application Guidelines for Surface Mount

Connectors (表面组装连接器设计和应用指南)

Design and Application Guidelines for the Use of

Solderless Surface Mount Connectors

(非焊接表面组装连接器设计和应用指南)

1/94 orig. pub.

IPC-BP-General Specification for Rigid Printed Board Backplanes

10/80 (orig. pub.) with Press-Fit Contacts

2011-3-4

IPC Document Revision Table421

IPC-D-422

(带压接连接器的刚性印制背板通用技术规范)

Design Guide for Press Fit Rigid Printed Board

Backplanes

(刚性压接印制背板设计指南)

IPC-DW-424

IPC-DW-425

IPC-DW-426

IPC-TR-460

IPC-TR-461

General Specification for Encapsulated Discrete Wire

Interconnection Boards

(印制板分立包皮导线互连通用技术规范)

Design and End Product Requirements for Discrete

Wiring Boards(分立线路板设计和成品技术规范)

Specifications for Assembly of Discrete Wiring

Page 9 of 18Reaffirmed 4/90

9/82 (orig. pub.)

1/95 (orig. pub.)

9/82 (orig. pub.)

A 5/90

12/87 (orig. pub.)

(分立线路组装技术规范)

Trouble-Shooting Checklist for Wave Soldering Printed

Wiring Boards (印制板波峰焊故障检查表)

Solderability Evaluation of Thick and Thin Fused

Coatings

(厚、薄热涂层的可焊性评估)

1973 (orig. pub)

A 2/84

3/79 (orig. pub.)

IPC-TR-462

IPC-TR-464

IPC-TR-465-1Solderability Evaluation of Printed Boards with Protective

Coatings Over Long Term Storage

(具有持效保护涂层的印制板可焊性评估)

Accelerated Aging for Solderability Evaluations

(可焊性的加速老化评估)

Round Robin Test on Steam Ager Temperature Control

Stability

(恒温蒸汽老化的联合测试报告)

10/87 (orig. pub.)

orig. pub.4/84

A 12/87

1993

IPC-TR-465-2The Effect of Steam Aging Time and Temperature on

Solderability Test Results

(蒸汔老化时间和温度对可焊性测试结果的影响)

1993

IPC-TR-465-3IPC-TR-466

Evaluation of Steam Aging on Alternative Finishes, Phase

IIA

( 对不同处理剂的蒸汽老化评估,Phase IIA)

Wetting Balance Standard Weight Comparison Test

7/96

4/95 (orig. pub.)

(润湿平衡标准称重比较测试)

2011-3-4

IPC Document Revision TableSupporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D(ANSI/J-STD-001附件D的支持数据和数字举例)

Factors Affecting Insulation Resistance Performance of

Printed Boards(印制板绝缘电阻的影响因素)

Thermal Characteristics of Multilayer Interconnection

Boards

(多层互连板的热特性)

IPC-TR-474

IPC-TR-476

IPC-TR-480

(作废)

IPC-TR-481

IPC-TR-483

IPC-TR-484

IPC-TR-485

IPC-TR-549

IPC-TR-551

IPC-DR-570

IPC-DR-572

IPC-TR-Page 10 of 18IPC-TR-467

IPC-TR-468

IPC-TR-470

10/96 (orig. pub.)

3/79 (orig. pub.)

1/74 (orig. pub.)

An Overview of Discrete Wiring Techniques(分立线路综3/79 (orig. pub.)

观) Reprint 1984

How to Avoid Metallic Growth Problems on Electronic

Hardware(如何避免电子硬件的合金化生长)

Results of Multilayer Test Program Round Robin IV

Phase I

9/77 (orig. pub.)

A 6/84

9/75 (orig. pub.)

Results of Multilayer Test Program Round Robin V

4/81 (orig. pub.)

(多层V循环测试程序的结果)

Dimensional Stability Testing of Thin Laminates - Report

4/84 (orig. pub.)

on Phase I International Round Robin Test Program

10/87 Addendums

Revised 3/91

(薄层压板尺寸稳定性测试---- )

Results of IPC Cooper Foil Ductility Round Robin Study

4/86 (orig. pub.)

(IPC Cooper 箔延展性研究联合报告)

Results of Cooper Foil Rupture Strength Test Round

Robin Study (Cooper 箔断裂强度研究联合报告)

Measles in Printed Wiring Boards(印制板内的粉点)

Quality Assessment of Printed Boards Used for Mounting

and Interconnecting Electronic Components

(电子元件安装互连印制板的质量评定)

General Specification for 1/8 Inch Diameter Shank

Carbide Drills for Printed Boards(1/8英寸印制板硬质合金钻头总技术规范)

1/79 (orig. pub.)

A 4/84

3/85 (orig. pub.)

11/73 (orig. pub.)

7/93 (orig. pub.)

Drilling Guidelines for Printed Boards(印制板钻孔指南) 4/88 (orig. pub.)

2011-3-4

IPC Document Revision Table576

(已作废)

IPC-TR-578

Page 11 of 18Additive Process Evaluation

Leading Edge Manufacturing Technology Report -

Resulting of a Round Robin Study on Minimum

Conductor Width and Plated-Through Holes in Rigid,

Bare Copper, Double-Sided Printed Wiring Boards(前沿制造技术报告---- )

Round Robin Reliability Evaluation of Small Diameter

Plated Through Holes in Printed Wiring Boards

(印制板小孔金属化可靠性评估联合报告)

9/77 (orig. pub.)

9/84 (orig. pub.)

IPC-TR-579

9/88 (orig. pub.)

IPC-TR-580

IPC-TR-581

IPC-TR-582

Cleaning and Cleanliness Test Program Phase 1 Test

Results

(清洗和洁净度测试程序第1阶段测试结果)

IPC Phase 3 Controlled Atmosphere Soldering Study

10/89 (orig. pub.)

8/94 (orig. pub.)

IPC Phase 3 可控气氛焊接研究)

IPC Phase 3 No-Clean Flux Study(IPC Phase 3免洗助焊剂研究)

11/94 (orig pub.)

orig pub. '64

A '70

B '74

C '78

D '89

E 8/95

F 11/99

Revision A: 2/99

(印制板质量评定手册)

Printed Board Quality Evaluation Slide Set

(印制板质量评定,幻灯片)

8/83 (orig. pub.)

2nd printing 1/86

3rd printing 5/88

A 3/90

B 12/94

Amendment 1/96

Revision C: 1/00

IPC-A-600 Acceptability of Printed Boards(印制板可接收条件)

IPC-QE-605A

IPC-SS-605

Printed Board Quality Evaluation Handbook

Acceptability of Electronic Assemblies

IPC-A-610

(电子组装的可接收条件)

IPC-QE-615

IPC-SS-Assembly Quality Evaluation Handbook(组装质量评定手3/93 (orig. pub.)

册)

Assembly Quality Evaluation Slide Set(组装质量评定,幻3/93 (orig. pub.)

2011-3-4

IPC Document Revision Table615

IPC-AI-640(已作废)

IPC-AI-641

IPC-AI-642

IPC-OI-645

IPC-TM-650

IPC-ET-652

灯片)

User's Guidelines for Automated Inspection of

Unpopulated Thick Film Hybrid Substrates

User's Guidelines for Automated Solder Joint Inspection

Page 12 of 18Revision A: 2/99

1/87 (orig. pub.)

1/87 (orig. pub.)

(自动焊点检查用户指南)

User's Guidelines for Automated Inspection of Artwork,

Interlayers, and Unpopulated PWB's

(照相底图,内层和PCB裸板自动检查用户指南)

Standard for Visual Optical Inspection Aids

10/93 (orig. pub.)

(光学检查目测标准)

Test Methods Manual(测试方法手册)

Guidelines and Requirements for Electrical Testing of

Unpopulated Printed Boards

(PCB裸板电气测试要求和导则)

Updated per test method

10/88 (orig. pub.)

10/90 (orig. pub.)

IPC-QL-653

IPC-MI-660

IPC-R-700C

被 IPC-7711 and

7721

Qualification of Facilities that Inspect/Test Printed

Boards, Components, and Material

(检查/测试印制板,元件和材料的设备鉴定)

Incoming Inspection of Raw Materials Manual

8/88 (orig. pub.)

A 11/97

2/84 (orig. pub.)

(原材料来料检查手册)

9/67 (orig. pub.)

A 12/71

B 9/77

C 1/88

Suggested Guidelines for Modification, Rework and

Repair of Printed Boards and Assemblies

替代

IPC-TA-720

IPC-TA-721

IPC-TA-722

Technology Assessment Handbook on Laminates

(层压板技术评估手册)

Technology Assessment Handbook on Multilayer Boards

(多层板技术评估手册)

Technology Assessment of Soldering(焊接技术评估)

2011-3-4

IPC Document Revision TableTechnology Assessment Handbook on Surface Mounting

(表面组装技术评估手册)

Technology Assessment Series on Cleanrooms

(净化间技术评估)

Troubleshooting Guide for Printed Board Manufacture

and Assembly(印制板制造及组装故障修理指南)

4/98

Page 13 of 18IPC-TA-723

IPC-TA-724

IPC-PE-740

1/85 (orig pub.)

A 12/97

9/68 (orig. pub.)

A 3/76

B 10/80

C 1/87

D 1/96

IPC-CM-770

IPC-SM-780

IPC-SM-782

IPC-EM-782

IPC-SM-784

IPC-SM-785

Printed Board Component Mounting(印制板元件安装)

Component Packaging and Interconnecting with Emphasis

3/88 (orig. pub.)

on Surface Mounting(片式元件SMC的封装和互连)

Surface Mount Design and Land Pattern Standard

(表面组装设计和焊盘图形标准)

Surface Mount Design and Land Pattern Spreadsheet

(表面组装设计和焊盘图形电子表格)

Guidelines for Chip-on-Board Technology

Implementation

(COB技术应用指南)

Guidelines for Accelerated Reliability Test of Surface

Mount Solder Attachments (表面组装焊接可靠性加速试11/92 (orig. pub.)

验指南)

12/90 (orig. pub.)

A 1/95

3/87 (orig. pub.)

9/89

A 8/93

Amendment 1 10/96

9/94 (orig. pub.)

Addendum 12/95

11/90 (orig. pub.)

IPC-SM-786

Procedures for Characterizing and Handling of Moisture/

已被 J-Reflow Sensitive ICs

STD-020替代

IPC-MC-790

Guidelines for Multichip Module Technology Utilization

8/92 (orig. pub.)

(多芯片模块技术应用指南)

IPC-S-804

(已作废)

Solderability Test Methods for Printed Wiring Boards

被 J-STD-003

1/82 (orig. pub.)

A 1/87

替代

2011-3-4

IPC Document Revision TablePage 14 of 18IPC-S-805

(已作废)

Solderability Tests for Component Leads and

被 J-STD-Terminations

002

1/85 (orig. pub.)

替代

IPC-MS-810

Guidelines for High Volume Microsection( 显微切面指南)

10/93 (orig. pub.)

IPC-S-815

(已作废)

General Requirements for Soldering Electronic

被 J-STD-Interconnections

001

(已废除,由J-STD-001替代)

替代

IPC-S-816

SMT Process Guideline and Checklist( SMT工艺指南和检查表)IPC-SM-817

General Requirements for Dielectric Surface Mounting

Adhesives (绝缘性表面组装胶粘剂通用规范)

11/77 (orig. pub.)

A 6/81

B 12/87

7/93 (orig. pub.)

11/89 (orig. pub.)

IPC-SF-818

(作废)General Requirement for Electronic Soldering Fluxes

被 J-STD-004

(用于电子组件焊接的助焊剂通用技术要求)2/88 (orig. pub.)

12/91

替代

IPC-SP-819

(作废)

被General Requirements and Test Methods for Electronic

J-STD-005Grade Solder Paste

10/88 (orig. pub.)

替代

IPC-AJ-820

IPC-CA-821

Assembly and Joining Manual(组装和连接手册)

General Requirements for Thermally Conductive

Adhesives

(热导胶粘剂通用技术要求)

IPC-CC-830

Qualification and Performance of Electronic Insulating

Compound for Printed Board Assemblies

(印制板组装电绝缘材料的鉴定和性能)

Pre and Post Solder Mask Application Cleaning

2011-3-41/84 (orig. pub.)

4/90 Reaffirmed

A 10/98

8/96 (orig. pub.)

1/95 (orig. pub.)

IPC Document Revision TableGuidelines

Page 15 of 18IPC-SM-839

IPC-SM-840

4/90 (orig. pub.)

(焊接前,后阻焊膜的清洗指南)

Qualification and Performance of Permanent Polymer

Coating (Solder Mask) for Printed Boards

(印制板阻焊膜的鉴定和性能)

11/77 (orig. pub.)

A 7/83

B 5/88

C 1/96

10/82 (orig. pub.)

IPC-H-855

Hybrid Microcircuit Design Guide

(己作废)

IPC-D-859

Design Standard for Thick Film Multilayer Hybrid

Circuits

(厚膜多层混合电路设计标准)

IPC-HM-860

IPC-TF-870

Specification for Multilayer Hybrid Circuits

12/89 (orig. pub.)

1/87 (orig. pub.)

(多层厚膜电路技术规范)

Qualification and Performance of Polymer Thick Film

Printed Boards(聚合物厚膜印制板的鉴定和性能)

11/89 (orig. pub.)

IPC-D-949

(作废)

Design Standard for Rigid Multilayer Printed Boards

被IPC-D-275

替代

IPC-ML-950

(已作废)

被 IPC-RB-276替代

IPC-ML-960

IPC-ML-975

1/87 (orig. pub.)

Performance Specification for Rigid Multilayer Printed

Boards

1/66 (orig. pub.)

A 9/70

B 12/77

C 11/86

Qualification and Performance Specification for Mass

Laminated Panels for Multilayer Printed Boards

(多层印制板预制内层敷箔板的鉴定和性能规范)

7/94 (orig. pub.)

被IPC-D-325

替代

IPC-ML-990

End Product Documentation Specification for Multilayer

Printed Wiring Boards

9/69 (orig. pub.)

Performance Specification for Flexible Multilayer Wiring 9/72 (orig. pub.)

2011-3-4

IPC Document Revision Table(作废)

IPC-Hybrid Microcircuit Design Guide(混合微波电路设计指1402/IPC-南)

H-855

IPC-1710

OEM Standard for Printed Board Manufacturers'

Qualification

Profile (MQP) (印制板OEM制造商资格鉴定一览表)

Assembly Qualification Profile (AQP)

IPC-1720 (印制板组装制造商资格鉴定一览表)

Page 16 of 1810/82 (orig. pub.)

2/94 (orig. pub.)

12/97 updated

7/96 (orig. pub.)

Laminator Qualification Profile (LQP)

IPC-1730

(层压板制造商资格鉴定一览表)

IPC-2141

Controlled Impedance Circuit Boards and High Speed

Logic Design(阻抗调制电路板和高速逻辑电路设计)

4/96 (orig. pub.)

2/98(orig. pub.)

1/98

IPC-2221 Generic Standard on Printed Board Design

代替 IPC-D-275

(印制板设计通用标准)

Sectional Design Standard for Rigid Organic Printed

IPC-2222

Boards

代替 IPC-D-275

(刚性有机印制板设计标准)

Sectional Design Standard for Flexible Printed Boards

IPC-2223

(柔性印制板设计标准)

IPC-3406

Guidelines for Electrically Conductive Surface Mount

Adhesives

(表面组装导电胶导则)

IPC-3408

IPC-4101

Specification for Base Materials for Rigid and Multilayer

代替 IPC-Boards

L-108 IPC-L-109

(刚性及多层印制板基材特性规范)

IPC-L-112

IPC-L-115

Specification and Characterization Methods for

General Requirements for Anistropically Conductive

Adhesive Films(各向异性导电胶粘剂通用技术要求)

2/98(orig. pub.)

11/98

7/96 (orig. pub.)

11/96 (.)

12/97 (orig. pub.)*

2011-3-4

IPC Document Revision TableNonwoven Cellulose Based Paper for Printed Boards

IPC-4110

(非织物纤维纸印制板的特性和规格)

IPC-4130

IPC-6011

(印制板通用性能规范)

IPC-6012

IPC-6013

Qualification and Performance Specification for Rigid

Printed Boards(刚性印制板的鉴定与性能规范)

Qualification and Performance Specification for Flexible

Printed Boards (柔性印制板的鉴定与性能规范)

Qualification and Performance Specification for Organic

Multichip Module (MCM-L) Mounting and

Interconnecting Structures

(有机多芯片模块(MCM-L)组装及互连结构的鉴定和性能规范)

Microwave End Product Board Inspection and Test

IPC-6018

(微波产品电路板的检查和测试)

Performace Guide Manual for Single- and Double-Sided

IPC/JPCA-Flexible Printed Wiring Boards

6202

(单、双面柔性印制电路板性能指导手册)

IPC-7711

Rework of Electronic Assemblies (电子组件的返修)

2/99

Specification and Characterization Methods for

Nonwoven "E" Glass Mat(非织物‘E’玻璃垫规范)

Generic Performance Specification for Printed Boards

9/98*

8/98*

Page 17 of 187/96 (orig. pub.)*

7/96 (orig. pub.)

A 10/99

11/98

IPC-6015 2/98 (orig. pub.)

1/98(orig. pub.)

代替 IPC-R-700C

IPC-7721

4/98 (orig. pub.)

代替 IPC-R-700C

IPC-9191

Repair and Modification of Printed Boards and Electronic

4/98 (orig. pub.)

Assemblies(印制板和电子组件的修理和调整)

代替

IPC-PC-90

IPC-9201

General Guideline for implementation of Statistical

Process Control (SPC) (SPC实施通则)

Surface Insulation Resistance Handbook

11/99 ()

7/96 (orig. pub.)

(表面绝缘电阻手册)

PWB Assembly Process Simulation for Evaluation of 7/95 (orig. pub.)

Electronic Components(电子元件组装工艺仿真的评价) Revision A: In process

IPC-9501

2011-3-4

IPC Document Revision TableAssembly Process Simulation for Evaluation of Non-IC

IPC-9504

Components(非IC器件组装工艺仿真的评价)

6/98

Page 18 of 182011-3-4