IPC-A-610国际标准中英文对

IPC-A-610国际规范中英文对照

4.6.2 Heat sink-Contact

散热片――接触片

arget-Class 1,2,3

目标——等级 1,2,3

· Component and heatsink are in

full contact with the

mounting surface.

组件和散热片与安装表面完全接触

· Hardware meets specified

attachment requirements.

部件满足规定的接触要求。

Figure图4-64

1. Heat sink

散热片

Acceptable-Class 1,2,3

可接受的——等级 1,2,3

· Component not flush.

组件不平齐

· Minimum 75% contact with

mounting surface.

至少有75%与安装表面接触

· Hardware meets mounting torque

requirements if

specified.

如果有规定，部件满足安装的转距要求

Figure图4-65

1. Gap 2. Heat sink

间隙散热片

Defect-Class 1,2,3

缺点——等级 1,2,3

· Component is not in contact

with mounting surface.

组件没有接触到安装表面

· Hardware is loose and can be

moved.

部件松弛可以移动。

Figure图4-66

1. Heat sink 2. Gap

散热片间隙

5.1 Orientation

方向

5.1.1 Orientation-Horizontal

方向——水平

Target-Class 1,2,3

目标——等级 1，2，3

•Components are centered

between their lands.

组件位于焊盘中央

•Component markings are

discernible.

组件标识清晰可见

•Nonpolarized components are

oriented so that

markings all read the same way (left-to-right

or top-to-bottom).

Figure图5-1 无极性组件的方向应使其标识都能按同样方式进行辨识

（从左到右或从上到下）

Acceptable-Class 1,2,3

可接受的——等级 1，2，3

•Polarized and multilead

components are oriented

correctly.

有极性和多引脚的组件应按正确方向安装。

•When hand formed and

hand-inserted, polarization

symbols are discernible.

当手工成型及手插件时，极性符号可以辨识。

•All components are as specified and terminate to

Figure图 5-2 correct lands.

所有组件都符合规定并连接到正确的焊盘上。

•Nonpolarized components do not need to be oriented so that markings all

read the same way(left-to right or top to-bottom).

无极性的组件不需要按同样的方向，只要标识可按相同方向辨识即可（从左到右或从上到下）.

5.1.1 Orientation-Horizontal(cont.)

方向——水平（续）

Defect-Class 1,2,3

缺点——等级1，2，3

•Component is not as specified

(Wrong part).

组件不符合规定（组件错误）

•Component not mounted in

correct holes.

组件没有安装在正确的孔中。

•Polarized component mounted

backwards.

有极性组件安装方向相反。

•Multileaded component not oriented correctly.

Figure图 5-3 多引脚组件的安装方向不正确。

5.1.2 Orientation-Vertical

方向——垂直

Target-Class 1,2,3

目标——等级 1，2，3

•Nonpolarized component

markings read from the top

down.

无极性组件的标识可以从上至下辨识

•Polarized markings are

located on top.

极性标识位于顶部.

Figure图 5-4

Acceptable-Class 1,2,3

可接受的——等级 1，2，3

•Polarized part is mounted with

a long ground lead.

极性组件安装时有长的接地引脚

•Polarized marking hidden.

极性标识被隐藏起来

•Nonpolarized component

markings read from bottom to

top.

无极性组件标识可以从底至上辨识。

Figure图 5-5

Defect-Class 1,2,3

缺点——等级 1，2，3

•Polarized component is mounted

backwards.

极性组件安装反向。

Figure图 5-6

5.2 Mounting

安装

5.2.1 Mounting-Horizontal-Axial

Leaded-Supported Holes

安装——水平——轴向引脚——有

支撑孔

Target-Class 1,2,3

目标——等级 1，2，3

•The entire body length of the component is in

contact with the board surface.

整个组件本体长度与线路板表面完全接触

•Components required to be mounted off the board are ,at least

1.5mm[0.059 in]from the board surface。 e.g., high heat dissipating.

需要离开线路板表面安装的组件至少要离开线路板

Figure图 5-7 平面1.5mm（0.059 in），如高散热器件.

Figure图 5-8

5.2.1

Mounting-Horizontal-Axial

Leaded-Supported Holes(cont.)

安装——水平——轴对称引脚——有支撑孔

Acceptable-Class 1,2

可接受的——等级 1，2，3

•The maximum space between the

component and the

board surface does not violate the requirements for

Figure图 5-9 ((H) is a

lead protrusion(see 5.2.7)or component height(H).

user-determined dimension.)

组件与线路板平面之间的最大间距不应违反引脚突出（见5.2.7）或组件高度（H）的要求。（高度（H）是由使用者决定的尺寸）

Process Indicator-Class 3

程序指示——等级 3

•The farthest distance between the component body and the board(D)

is larger than 0.7mm[0.028 in].

组件本体与线路板之间的最大的距离（D）超过0.7mm（0.028 in）。

Defect-Class 1,2,3

缺点——等级 1，2，3

•Components required to be mounted above the board surface are less

than 1.5mm[0.059 in]

要求离开线路板表面安装的组件与线路板的距离小于1.5mm（0.059 in）.

5.2.2 Mounting-Horizontal-Axial

Leaded-Unsupported Holes

安装——水平——轴向引脚——无支撑的孔

Target-Class 1,2,3

目标——等级 1.2.3

•The entire body length of the

component is in

contact with the board

surface.

整个组件本体长度与线路板表面完全接触.

•Components required to be mounted off the board are

at minimum 1.5mm[0.059 in] from the board

Figure图 5-10 surface 。e.g. ,high heat

dissipating.

Plating in barrel 需要离开线路板表面安装的组件至少要离开线路板平

孔壁上没有电镀面1.5mm（0.059 in），如高散热器件.

Components required to be mounted off the board are provided with lead

forms at the board surface or other mechanical support to prevent

lifting of solder land.

需要离开线路板安装的组件在线路板表面利用引脚形状或其它机械支撑来防止焊盘的翘起。

Figure图 5-11 Figure图 5-12

1. Lead forms

引脚形状

Defect-Class 1,2,3

缺点——等级 1，2，3

•Components required to be mounted off the board are

not provided with lead forms at the board surface

or other mechanical support to prevent lifting of

solder land.

Figure图 5-13

需要离开面板安装的组件在线路板表面未利用引脚的形状或其它机械支撑来防止焊盘翘起

•surface Components required to

be mounted above the board are

less than 1.5mm[0.059 in].

要求离开线路板表面安装的组件与线路板的距离小于1.5mm（0.059

in）

Figure图 5-14

5.2.3

Mounting-Horizontal-Radial

Leaded

安装——水平——径向引脚

Target-Class 1,2,3

目标——等级 1，2，3

•The component body is in flat

contact with

the board's surface.

组件本体与线路板表面平贴接触

• Bonding material is present, if required .See4.4.

若需要，则可存在粘贴的物质，见4.4

Figure图 5-15

Acceptable-Class 1,2,3

可接受的——等级 1，2，3

•Component in contact with

board on at least one

side and/or surface.

组件与线路板至少有一边和/或面接触。

Note: When documented on an

approved assembly

drawing, a component may be

either side mounted

or end mounted. The side or surface of the body, or at

least one point of any irregularly configured

component(such as certain pocketbook capacitors), needs

Figure图 5-16 to be in full contact with the

printed board. The body

should to be bonded or otherwise retained to the board to prevent damage

when vibration and shock forces are applied.

注意：在被认可的组装图中，一个组件既可能是面安装也可能是边沿安装。组件体的表面或侧面，或不规则形状组件的至少一点（如某种袖珍电容），需要与印刷线路板完全接触。组件本体应粘贴或保持在线路板上以防止在震动或撞击时损坏。

Defect-Class 1,2,3

缺点——等级 1，2，3

•Unbonded component body not in

contact with

mounting surface.

未粘贴的组件本体没有和安装表面接触。

•Bonding material not present

if required.

在有要求时，却没有粘贴物质。

Figure图 5-17

.2.4 Mounting-Vertical-Axial Leaded-Supported Holes

安装——垂直——轴向引脚——有支撑的孔

Target-Class 1,2,3

目标——等级 1，2，3

•The height of the component

body above the land,

(H)is 0.4mm[0.016 in]to1.5mm

[0.059 in].

组件本体距离焊盘的高度，（H）为0.4mm（0.016in）到

1.5m（0.059in）之间。

•The component body is perpendicular to the board.

组件本体与线路板垂直

Figure图 5-18 •The overall height does

not exceed the height

specified.

总的高度未超过规定的高度.

Acceptable-Class 1,2,3

可接受的——等级 1，2，3

•The component height above the

board,(H)is not

outside the range given in Table

5-1.

组件距离线路板的高度(H)未超出表5-1给出的范围。

•The angle(θ) of the component

lead does not

cause a violation of minimum electrical

clearance.

组件引脚的角度未产生对最小电气间隙的影响。

Figure图 5-19

Table 5-1 Component to Board Height

表 5-1 组件到线路板的高度

H(min)最小值

H(max)最大值

Class1等级1 Class2等级2 Class3等级3

0.1mm[0.0039in] 0.4mm[0.016in] 0.4mm[0.016in]

6mm[0.24in] 3mm[0.12in] 1.5mm[0.059in]

5.2.4 Mounting-Vertical-Axial Leaded-Supported Holes(cont.)

安装——垂直——轴向引脚——有支撑孔（续）

Acceptable-Class 1

可接受的—等级 1

Process Indicator-Class 2,3

中给出的最大值。

Figure图 5-20 Defect-Class 1,2,3

minimum electrical clearance.

过程指示——等级 2，3

•The component mounting

height(H)is greater than

the maximum given in Table

5-1.

组件安装高度（H）超过了表5-1缺点——等级 1，2，3

•Components violate

组件影响到最小电气间隙。